Japan, Oct. 30 -- LINTEC CORP has got intellectual property rights for 'ADHESIVE PASTE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2023-006046
Category (FI): H01L21/52@E,C09J183/04,H10W72/30@E,C09J11/06
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 18, 2023
Publication Date: July 30, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
