Japan Intellectual Property Rights: ADHESIVE SHEET FOR ELECTRONIC COMPONENT TRANSFER AND METHOD FOR PROCESSING ELECTRONIC COMPONENT USING ADHESIVE SHEET FOR ELECTRONIC COMPONENT TRANSFER

Japan, April 1 -- NITTO DENKO CORP has got intellectual property rights for 'ADHESIVE SHEET FOR ELECTRONIC COMPONENT TRANSFER AND METHOD FOR PROCESSING ELECTRONIC COMPONENT USING ADHESIVE SHEET FOR ELECTRONIC COMPONENT TRANSFER.' Other related details are as follows:

Application Number: JP,2021-013167

Category (FI): C09J7/22,H01L21/52@E,H10W72/30@E,C09J7/38,C09J133/06

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Jan. 29, 2021

Publication Date: Aug. 10, 2022

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.