Japan, Jan. 23 -- TESA SE has got intellectual property rights for 'ADHESIVE TAPE, BONDED COMPOSITE, AND METHOD FOR ELECTRICALLY RELEASING BONDED COMPOSITE.' Other related details are as follows:
Application Number: JP,2024-042074
Category (FI): C09J7/30,C09J11/06,C09J11/04,C09J133/04,C09J7/35,C09J7/29
Stage: Grant (IP right document published.)
Filing Date: March 18, 2024
Publication Date: Nov. 7, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
