Japan, July 27 -- SHINKAWA LTD has got intellectual property rights for 'BONDING DEVICE, METHOD, AND PROGRAM.' Other related details are as follows:
Application Number: JP,2023-178298
Category (FI): H01L21/50@F,H01L21/60,311@T,H10W72/00,101@T,H10W95/00@F
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Oct. 16, 2023
Publication Date: April 28, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
