Japan, Nov. 17 -- CHINA ACADEMY OF MACHINERY ZHENGZHOU RESEARCH INSTITUTE OF MECHANICAL ENGINEERING CO LTD has got intellectual property rights for 'BONDING WIRE, PREPARATION METHOD THEREOF AND LED DEVICE.' Other related details are as follows:
Application Number: JP,2024-204383
Category (FI): C22C5/08,B22F1/05,B22F9/08@A,B22F5/12,B22F1/00@K,B22F3/20@C,C22C5/06@C
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Nov. 25, 2024
Publication Date: June 19
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
