Japan, April 9 -- CHIPBOND TECHNOLOGY CORP has got intellectual property rights for 'CHIP BODY AND METHOD FOR MANUFACTURING THE SAME.' Other related details are as follows:
Application Number: JP,2024-225002
Category (FI): H10W70/06,H10W40/20@A,H10W40/00,100,H01L23/34@A,H10W70/68
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Dec. 20, 2024
Publication Date: Aug. 1, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
