Japan, Jan. 16 -- SAMSUNG ELECTRONICS CO LTD has got intellectual property rights for 'CHIP PEELING DEVICE AND CHIP PEELING METHOD.' Other related details are as follows:
Application Number: JP,2021-199182
Category (FI): H01L21/68@E,H01L21/78@Y,H10P58/00@Y,H10P72/00@E
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Dec. 8, 2021
Publication Date: June 20, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
