Japan, July 14 -- HAKKO KK has got intellectual property rights for 'CUTTING DEVICE.' Other related details are as follows:
Application Number: JP,2024-080803
Category (FI): B23D29/00@B,B26B15/00
Stage: PROBLEM TO BE SOLVED: To facilitate the work of cutting a solder suctioning tool.SOLUTION: A cutting device 10 for cutting a solder suctioning tool comprises: a cutter 20 with a pair of blades 22a; a start part 26 which includes a sensor 24, and outputs a start command when the sensor 24 is set to a detection state; a cutter drive part which is operable to apply force for cutting the solder suctioning tool to the cutter 20; and a control part 30 which is electrically connected to the start part 26, and actuates the cutter drive part when receiving a start command.SELECTED DRAWING: Figure 1 (Grant)
Filing Date: May 17, 2024
Publication Date: Nov. 28, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
