Japan, Jan. 23 -- NITTO DENKO CORP has got intellectual property rights for 'DICING DIE BOND FILM.' Other related details are as follows:
Application Number: JP,2021-208223
Category (FI): H01L21/78@M,C09J7/38,C09J7/22,H10P58/00@M
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Dec. 22, 2021
Publication Date: July 4, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
