Japan, June 10 -- SHIN ETSU CHEM CO LTD has got intellectual property rights for 'DIE BONDING ORGANIC MODIFIED SILICONE RESIN COMPOSITION, HARDENING MATERIAL OF THEM, AND OPTICAL SEMICONDUCTOR ELEMENT.' Other related details are as follows:
Application Number: JP,2023-116199
Category (FI): H01L33/48,H01L21/52@E,C08K5/541,C08L83/05,C08L63/00@A,C08G59/24,C08G59/20,C08L83/07,C08K5/549,H10W72/30@E,H10H20/85
Stage: Grant (IP right document published.)
Filing Date: July 14, 2023
Publication Date: Jan. 24, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
