Japan, April 14 -- TU TE-SUNG,KSEC CO LTD,YANG SHIH-CHING has got intellectual property rights for 'DIODE WAFER AND METHOD FOR MANUFACTURING PROCESSED WAFER.' Other related details are as follows:
Application Number: JP,2024-134331
Category (FI): H01L21/66@J,H10P95/00,102@B,H10D8/01@Z,H10P74/20@J,H10P54/90,101@Z,C30B33/00,H01L21/304,611@Z
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Aug. 9, 2024
Publication Date: Feb. 25, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
