Japan Intellectual Property Rights: ETCHING METHOD, ETCHING EQUIPMENT, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING ORIGINAL PLATE

Japan, Jan. 23 -- KIOXIA CORP has got intellectual property rights for 'ETCHING METHOD, ETCHING EQUIPMENT, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING ORIGINAL PLATE.' Other related details are as follows:

Application Number: JP,2022-048499

Category (FI): H01L21/302,105@A,H10P50/28,H10P50/20,105@A,H10P50/24

Stage: Grant (IP right document published.)

Filing Date: March 24, 2022

Publication Date: Oct. 5, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.