Japan, Jan. 19 -- MITSUBISHI CHEMICAL CORP has got intellectual property rights for 'ETCHING SOLUTION, ETCHING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT.' Other related details are as follows:
Application Number: JP,2022-032009
Category (FI): C23F1/34,H01L21/306@F,H01L21/308@F,H10P50/66
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 2, 2022
Publication Date: Sept. 14, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
