Japan Intellectual Property Rights: FILM FORMING METHOD, RESIN LAYER FORMING DEVICE, FILM FORMING DEVICE, AND CIRCUIT BOARD WITH ELECTROMAGNETIC WAVE SHIELD

Japan, Jan. 20 -- SHIBAURA MECHATRONICS CORP has got intellectual property rights for 'FILM FORMING METHOD, RESIN LAYER FORMING DEVICE, FILM FORMING DEVICE, AND CIRCUIT BOARD WITH ELECTROMAGNETIC WAVE SHIELD.' Other related details are as follows:

Application Number: JP,2021-161215

Category (FI): H10W74/15,H10W42/20,H01L23/28@F,H01L23/28@K,H01L23/30@D,C23C14/06@T,H05K9/00@R,H05K3/28@B,H01L23/00@C

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Sept. 30, 2021

Publication Date: April 11, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.