Japan, Oct. 30 -- MEKTEC CORP has got intellectual property rights for 'FLEXIBLE PRINTED WIRING BOARD WITH MOLDED COMPONENT AND MANUFACTURING METHOD THEREOF.' Other related details are as follows:
Application Number: JP,2023-093714
Category (FI): B29C45/14
Stage: Grant (IP right granted following substantive examination.)
Filing Date: June 7, 2023
Publication Date: Dec. 19, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
