Japan, June 10 -- DISCO CORP has got intellectual property rights for 'GRINDING METHOD FOR WAFER.' Other related details are as follows:
Application Number: JP,2022-108361
Category (FI): B24B7/00@A,H10P52/00@C,H01L21/304,631,B24B41/06@L,B24B7/04@A
Stage: Grant (IP right granted following substantive examination.)
Filing Date: July 5, 2022
Publication Date: Jan. 18, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
