Japan, Feb. 27 -- GENIS WHITE CO LTD has got intellectual property rights for 'HEAT-SENSITIVE FLEXIBLE-MOVING DEVICE.' Other related details are as follows:
Application Number: JP,2021-023948
Category (FI): B32B15/08@D,B32B27/00@B,B32B27/30@D,B32B7/028,F16K31/70@A
Stage: PROBLEM TO BE SOLVED: To provide a heat-sensitive flexible-moving device that allows increased difference in thermal expansion coefficient between constituent materials of a heat-sensitive member and can achieve larger flexible amounts using reduced heat-sensitive members.SOLUTION: A heat-sensitive flexible-moving device comprises a heat-sensitive member comprising one material composed of a resin and the other material composed of a metal or a resin having a lower thermal expansion coefficient than that of the resin of the one material.SELECTED DRAWING: Figure 1 (Grant)
Filing Date: Feb. 18, 2021
Publication Date: Aug. 30, 2022
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
