Japan, Feb. 27 -- INTEL CORP has got intellectual property rights for 'IMPROVED MEMORY MODULE TO SAVE WIRING SPACE ON MOTHERBOARD.' Other related details are as follows:
Application Number: JP,2021-156032
Category (FI): G11C5/04,200
Stage: PROBLEM TO BE SOLVED: To provide an improved memory module to save wiring space on a motherboard, and a device and a computing system with the memory module.SOLUTION: A device includes a DIMM 201 for connecting a motherboard 202. The DIMM201 includes connectors 203_1 and 203_2 along a central axis 201 of the DIMM 201. The DIMM201 further includes a first semiconductor chip (PMIC chip 211) located in a first region of the DIMM 201 that resides between an edge portion of the DIMM201 and the side of the connector. The DIMM 201 includes a second semiconductor chip (high-performance semiconductor chip 204) located in a second region of the DIM 201 existing between the opposite edge portion of the DIM 201 and the opposite side of the connector.SELECTED DRAWING: Figure 2 (Grant)
Filing Date: Sept. 24, 2021
Publication Date: July 5, 2022
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
