Japan, Nov. 11 -- SEIKO EPSON CORP has got intellectual property rights for 'INJECTION MOLDING DEVICE AND MOLD FOR INJECTION MOLDING DEVICE.' Other related details are as follows:
Application Number: JP,2021-105352
Category (FI): B29C45/38@F,B29C45/03,B29C45/17,B29C45/34,B29C45/38@E,B29C45/76,B29C45/40
Stage: Grant (IP right granted following substantive examination.)
Filing Date: June 25, 2021
Publication Date: Jan. 17, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
