Japan, Feb. 27 -- DIC CORP has got intellectual property rights for 'LAMINATE AND METHOD FOR MANUFACTURING THE SAME.' Other related details are as follows:
Application Number: JP,2021-099352
Category (FI): B32B15/08@J,B32B27/30@D,B32B27/34,B32B27/38,B32B27/42,101,H05K1/03,630@E
Stage: PROBLEM TO BE SOLVED: To provide a laminate which has a smooth interface between an insulating base material having a thermoplastic resin on an outermost surface layer and a metal layer formed on the insulating base material, and has excellent adhesion between the insulator and the metal layer, a method for manufacturing the same, and a printed wiring board manufactured using the laminate.SOLUTION: The inventors have found out a laminate having excellent adhesion by using a laminate in which a thermoplastic resin layer (B), a primer layer (C) and a metal layer (D) are laminated sequentially on an insulating base material (A).SELECTED DRAWING: None (Grant)
Filing Date: June 15, 2021
Publication Date: Dec. 27, 2022
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
