Japan, Jan. 23 -- TDK CORP has got intellectual property rights for 'LAMINATED CHIP COMPONENT AND MANUFACTURING METHOD THEREOF.' Other related details are as follows:
Application Number: JP,2021-129286
Category (FI): H01F27/00@Q,H01C1/04,H01G2/24,G06K19/06,121,G06K19/06,037
Stage: Grant (IP right document published.)
Filing Date: Aug. 5, 2021
Publication Date: Feb. 16, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
