Japan, Jan. 20 -- MURATA MFG CO LTD has got intellectual property rights for 'MANUFACTURING METHOD OF ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT HOLDING JIG.' Other related details are as follows:

Application Number: JP,2023-007210

Category (FI): H01G4/30,517,H01C7/02,H01C7/00,400,H01G13/00,351@A,H01G4/30,311@Z,H01C7/04,H01G13/00,351@Z

Stage: Grant (IP right document published.)

Filing Date: Jan. 20, 2023

Publication Date: Aug. 1, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.