Japan, Jan. 20 -- MURATA MFG CO LTD has got intellectual property rights for 'MANUFACTURING METHOD OF ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT HOLDING JIG.' Other related details are as follows:
Application Number: JP,2023-007210
Category (FI): H01G4/30,517,H01C7/02,H01C7/00,400,H01G13/00,351@A,H01G4/30,311@Z,H01C7/04,H01G13/00,351@Z
Stage: Grant (IP right document published.)
Filing Date: Jan. 20, 2023
Publication Date: Aug. 1, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.