Japan, Jan. 23 -- NITTO DENKO CORP has got intellectual property rights for 'MANUFACTURING METHOD OF ELECTRONIC COMPONENT DEVICE.' Other related details are as follows:
Application Number: JP,2022-063382
Category (FI): H01L21/60,311@Q,H01L21/78@B,H01L21/78@M,H01L21/78@P,H01L21/78@Q,H01L21/78@X,H10P58/00@M,H10P58/00@P,H10P58/00@Q,H10W72/00,101@Q
Stage: Grant (IP right granted following substantive examination.)
Filing Date: April 6, 2022
Publication Date: April 17, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.