Japan, Jan. 23 -- NITTO DENKO CORP has got intellectual property rights for 'MANUFACTURING METHOD OF ELECTRONIC COMPONENT DEVICE.' Other related details are as follows:

Application Number: JP,2022-063382

Category (FI): H01L21/60,311@Q,H01L21/78@B,H01L21/78@M,H01L21/78@P,H01L21/78@Q,H01L21/78@X,H10P58/00@M,H10P58/00@P,H10P58/00@Q,H10W72/00,101@Q

Stage: Grant (IP right granted following substantive examination.)

Filing Date: April 6, 2022

Publication Date: April 17, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.