Japan Intellectual Property Rights: MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Japan, Jan. 23 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE.' Other related details are as follows:

Application Number: JP,2021-139165

Category (FI): H01L21/78@R,H10P58/00@S,H01L25/08@C,H10P58/00@Q,H01L21/78@S,H01L21/78@Q,H10P58/00@R,H10W90/20@C

Stage: Grant (IP right document published.)

Filing Date: Aug. 27, 2021

Publication Date: March 9, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.