Japan Intellectual Property Rights: METHOD AND APPARATUS FOR PACKAGING INTEGRATED CIRCUIT DEVICES

Japan, Oct. 5 -- ALL RING TECH CO LTD has got intellectual property rights for 'METHOD AND APPARATUS FOR PACKAGING INTEGRATED CIRCUIT DEVICES.' Other related details are as follows:

Application Number: JP,2025-039135

Category (FI): H01L23/36@D,H10W40/60@M,H10W40/20@Z,H01L23/36@Z

Stage: Grant (IP right granted following substantive examination.)

Filing Date: March 12, 2025

Publication Date: Jan. 19

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.