Japan Intellectual Property Rights: METHOD AND SYSTEM FOR MACHINING WAFER

Japan, June 10 -- DISCO CORP has got intellectual property rights for 'METHOD AND SYSTEM FOR MACHINING WAFER.' Other related details are as follows:

Application Number: JP,2022-091773

Category (FI): H01L21/304,631,H10P95/60@Z,H10P72/30@A,H10P52/40,H10P52/00@W,H10P52/00@T,H10P52/00@R,H10P52/00@C,H10P52/00@A,B24B37/10,H01L21/68@A,H01L21/304,621@B,H01L21/304,622@W,H01L21/304,622@Q,H01L21/304,601@Z,B24B7/04@Z

Stage: Grant (IP right granted following substantive examination.)

Filing Date: June 6, 2022

Publication Date: Dec. 18, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.