Japan Intellectual Property Rights: METHOD AND SYSTEM FOR SECURE CONNECTION IN LAYER SEGMENT OF CUT LAYER ADDITIVE PART

Japan, April 6 -- THERMWOOD CORP has got intellectual property rights for 'METHOD AND SYSTEM FOR SECURE CONNECTION IN LAYER SEGMENT OF CUT LAYER ADDITIVE PART.' Other related details are as follows:

Application Number: JP,2024-219712

Category (FI): F16B5/00@F,B29C64/393,B33Y50/02,B33Y30/00,B33Y10/00,B29C64/147

Stage: Grant (IP right granted following substantive examination.)

Filing Date: Dec. 16, 2024

Publication Date: Aug. 5, 2025

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.