Japan, Nov. 6 -- HITACHI POWER SEMICONDUCTOR DEVICE LTD has got intellectual property rights for 'METHOD FOR ANALYZING MOLDING PROCESS OF THERMOSETTING RESIN.' Other related details are as follows:
Application Number: JP,2022-137027
Category (FI): G06F30/28,B29C45/02,B29C45/14,G06F30/20,B29K101:10,B29C45/76
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Aug. 30, 2022
Publication Date: March 13, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
