Japan, Sept. 9 -- RICOH CO LTD has got intellectual property rights for 'METHOD FOR FORMING CONDUCTIVE LAYER, CONDUCTIVE LAYER, ELECTRONIC MODULE, AND ELECTRONIC APPARATUS.' Other related details are as follows:
Application Number: JP,2022-042458
Category (FI): H10W74/10@F,B05D1/36@Z,B05D7/00@P,B05D5/12@B,H01L23/28@F,H05K9/00@Q,H05K3/12
Stage: Grant (IP right granted following substantive examination.)
Filing Date: March 17, 2022
Publication Date: Sept. 29, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
