Japan Intellectual Property Rights: METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SUPPORT SUBSTRATE AND METHOD FOR PEELING SUBSTRATE

Japan, Nov. 4 -- KIOXIA CORP has got intellectual property rights for 'METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SUPPORT SUBSTRATE AND METHOD FOR PEELING SUBSTRATE.' Other related details are as follows:

Application Number: JP,2023-030650

Category (FI): H01L21/02@B,H01L21/265,602@A,H01L21/265,602@B,H01L21/265@F,H01L21/265@W,H01L21/306@B,H01L29/78,371,H10B41/27,H10B43/27,H10D30/01,501,H10D30/68,H10D30/69,H10P10/00@Z,H10P30/20@F,H10P30/20@W,H10P30/28@H,H10P30/28@J,H10P50/60@A,H10P56/00@A,H10P56/00@Z,H10P90/00@B

Stage: Grant (IP right granted following substantive examination.)

Filing Date: March 1, 2023

Publication Date: Sept. 12, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.