Japan, March 27 -- RICOH CO LTD has got intellectual property rights for 'METHOD FOR MANUFACTURING THERMALLY CONDUCTIVE STRUCTURE AND METHOD FOR MANUFACTURING HEAT RADIATION STRUCTURE.' Other related details are as follows:

Application Number: JP,2022-039811

Category (FI): H01L23/36@D,H01L23/36@M,H10W40/00,100,H10W40/25,H10W40/60@M,H10W40/60@Z

Stage: Grant (IP right granted following substantive examination.)

Filing Date: March 15, 2022

Publication Date: Sept. 28, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.