Japan, Oct. 21 -- ATECO INC has got intellectual property rights for 'METHOD OF LOADING SEMICONDUCTOR DEVICE WITH FINE BUMPS INTO INSERT.' Other related details are as follows:
Application Number: JP,2025-026058
Category (FI): G01R31/26@J
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Feb. 20, 2025
Publication Date: Dec. 11, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
