Japan, June 10 -- DISCO CORP has got intellectual property rights for 'METHOD OF PROCESSING WAFER AND LASER APPLYING APPARATUS.' Other related details are as follows:
Application Number: JP,2022-080666
Category (FI): B23K26/364,H01L21/78@Q,H01L21/78@B,H10P58/00@Q,H10P58/00@B,B23K26/062,B23K26/073
Stage: Grant (IP right granted following substantive examination.)
Filing Date: May 17, 2022
Publication Date: Nov. 30, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
