Japan, June 10 -- CHUNG YUAN CHRISTIAN UNIV has got intellectual property rights for 'MOLD DEVICE INCLUDING MOLD SENSOR COOLING STRUCTURE.' Other related details are as follows:
Application Number: JP,2022-141165
Category (FI): B29C45/26
Stage: Grant (IP right document published.)
Filing Date: Sept. 6, 2022
Publication Date: Oct. 30, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
