Japan, Sept. 9 -- SEIKO EPSON CORP has got intellectual property rights for 'MOLDING MANUFACTURING METHOD.' Other related details are as follows:
Application Number: JP,2022-104322
Category (FI): D06M15/03,D04H1/732,B27N3/04@D,D06M11/79
Stage: Grant (IP right granted following substantive examination.)
Filing Date: June 29, 2022
Publication Date: Jan. 17, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
