Japan, Jan. 15 -- SAMSUNG ELECTRO-MECHANICS CO LTD has got intellectual property rights for 'MULTILAYER ELECTRONIC COMPONENT.' Other related details are as follows:
Application Number: JP,2022-068090
Category (FI): H01G4/30,201@C,H01G4/30,201@F,H01G4/30,201@N,H01G4/30,512,H01G4/30,513
Stage: Grant (IP right document published.)
Filing Date: April 18, 2022
Publication Date: June 20, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
