Japan, Jan. 16 -- DUPONT ELECTRONIC MATERIALS INTERNATIONAL LLC has got intellectual property rights for 'PHOTORESIST UNDERLAYER COMPOSITION AND METHOD FOR FORMING ELECTRONIC DEVICE.' Other related details are as follows:
Application Number: JP,2023-218140
Category (FI): C08F238/00,G03F7/11,503,H01L21/30,573,H10P76/00,573
Stage: Grant (IP right document published.)
Filing Date: Dec. 25, 2023
Publication Date: July 11, 2024
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
