Japan, Jan. 19 -- FUJIFILM CORP has got intellectual property rights for 'PHOTOSENSITIVE COMPOSITION, TRANSFER FILM, CURED FILM, SEMICONDUCTOR PACKAGE, PATTERNING METHOD, METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE.' Other related details are as follows:
Application Number: JP,2022-013367
Category (FI): G03F7/004,501,G03F7/004,512,G03F7/027,515,H05K3/06@H
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Jan. 31, 2022
Publication Date: Aug. 10, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.