Japan Intellectual Property Rights: PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, METHOD FOR PRODUCING CURED PRODUCT, LAMINATE, AND ELECTRONIC COMPONENT

Japan, Jan. 23 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, METHOD FOR PRODUCING CURED PRODUCT, LAMINATE, AND ELECTRONIC COMPONENT.' Other related details are as follows:

Application Number: JP,2023-216095

Category (FI): G03F7/029,H01L21/312,G03F7/027,513,G03F7/075,501,G03F7/027,515,G03F7/027,502,G03F7/004,501,G03F7/004,502,G03F7/031,G03F7/028,H10P14/68@Z,H05K3/00@F

Stage: Grant (IP right document published.)

Filing Date: Dec. 21, 2023

Publication Date: March 25, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.