Japan, Jan. 23 -- NAMICS CORP has got intellectual property rights for 'RESIN COMPOSITION, AND ADHESIVE FILM, LAMINATED CIRCUIT BOARD, ELECTRONIC COMPONENT, AND SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2025-111208
Category (FI): C08J5/18,C08K3/013,C08K5/14,C08L101/02,C08L39/04,C08L47/00,C08L53/02,C08L71/02,C08L71/12,C08L9/00,C09J109/00,C09J11/04,C09J11/08,C09J4/00,C09J7/35,H05K1/03,610@N
Stage: Grant (IP right granted following substantive examination.)
Filing Date: July 1, 2025
Publication Date: Oct. 7, 2025
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
