Japan, March 27 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'RESIN COMPOSITION, ELECTRONIC COMPONENT DEVICE, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE, AND METHOD FOR PRODUCING RESIN COMPOSITION.' Other related details are as follows:
Application Number: JP,2021-208530
Category (FI): C08G59/40,C08G59/68
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Dec. 22, 2021
Publication Date: July 4, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
