Japan, April 1 -- MITSUBISHI ENGINEERING PLASTICS CORP has got intellectual property rights for 'RESIN COMPOSITION, MOLDED BODY, AND ELECTROMAGNETIC WAVE ABSORBER.' Other related details are as follows:
Application Number: JP,2022-026729
Category (FI): C08J3/20@Z,C08J3/22,C08K3/04,C08L101/00,C08L25/04,C08L67/02,H05K9/00@M,H05K9/00@W
Stage: Grant (IP right granted following substantive examination.)
Filing Date: Feb. 24, 2022
Publication Date: Sept. 6, 2022
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
