Japan, Jan. 23 -- MCPP INNOVATION LLC has got intellectual property rights for 'RESIN COMPOSITION AND MOLDED PRODUCT USING THE SAME, ELECTRIC WIRE COATING MATERIAL AND COATED ELECTRIC WIRE.' Other related details are as follows:
Application Number: JP,2021-112883
Category (FI): C08L23/26,C08L83/04,C08K3/22,H01B7/02@Z,H01B3/44@G,H01B3/44@F
Stage: Grant (IP right granted following substantive examination.)
Filing Date: July 7, 2021
Publication Date: Jan. 20, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
