Japan Intellectual Property Rights: RESIN PARTICLE, CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE

Japan, March 27 -- SEKISUI CHEM CO LTD has got intellectual property rights for 'RESIN PARTICLE, CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE.' Other related details are as follows:

Application Number: JP,2021-110223

Category (FI): C08G73/10,C08J3/16,C08J7/044,H01B1/00@C,H01B1/00@G,H01B1/00@M,H01B1/22@A,H01B1/22@B,H01B5/00@C,H01B5/00@G,H01B5/00@M,H01R11/01,501@D

Stage: Grant (IP right granted following substantive examination.)

Filing Date: July 1, 2021

Publication Date: Jan. 18, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.