Japan, Jan. 16 -- APIC YAMADA CORP has got intellectual property rights for 'RESIN SEALING DEVICE AND RESIN SEALING METHOD.' Other related details are as follows:
Application Number: JP,2022-067508
Category (FI): B29C33/72,H01L21/56@R,H10W74/01@R
Stage: Grant (IP right document published.)
Filing Date: April 15, 2022
Publication Date: Oct. 26, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
