Japan, Jan. 23 -- TOKYO OHKA KOGYO CO LTD has got intellectual property rights for 'RINSE SOLUTION, SUBSTRATE PROCESSING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT.' Other related details are as follows:
Application Number: JP,2022-024190
Category (FI): H10P70/00,201@N,H10P70/00,107@A,H01L21/304,647@A
Stage: Grant (IP right document published.)
Filing Date: Feb. 18, 2022
Publication Date: Aug. 30, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
