Japan, Jan. 16 -- RESONAC HOLDINGS CORP has got intellectual property rights for 'SEALING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE.' Other related details are as follows:
Application Number: JP,2021-116721
Category (FI): C08K3/04,C08K3/22,C08L63/00,C08L63/00@C,H01L23/28@H,H10W74/10@H
Stage: Grant (IP right granted following substantive examination.)
Filing Date: July 14, 2021
Publication Date: Jan. 26, 2023
The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100
Disclaimer: Curated by HT Syndication.
