Japan Intellectual Property Rights: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Japan, Oct. 30 -- RENESAS ELECTRONICS CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME.' Other related details are as follows:

Application Number: JP,2022-032023

Category (FI): H10D64/23@Z,H01L29/50@B,H01L29/44@S,H01L29/06,301@V,H01L29/06,301@D,H01L27/06,102@A,H01L29/78,652@C,H01L29/78,652@F,H01L29/91@L,H10D1/47,101,H10D12/00,101@A,H10D12/00,101@C,H10D12/00,101@F,H10D12/00,101@G,H10D12/00,101@H,H10D12/00,102@D,H10D12/00,102@F,H10D12/00,103@S,H10D12/00,201@A,H10D12/01@F,H10D12/01@G,H10D30/01,301@F,H10D30/01,301@G,H10D30/66,101@C,H10D30/66,101@F,H10D30/66,101@H,H10D30/66,102@S,H10D30/66,201@A,H10D62/10,101@D,H10D62/10,101@V,H10D64/01@L,H10D64/20@Z,H10D64/23@B,H10D64/23@D,H10D64/27@G,H01L29/78,652@H,H01L29/78,652@J,H01L27/04@P,H01L21/28@L,H01L29/78,652@M,H01L29/78,653@A,H01L29/78,655@A,H01L29/78,655@C,H01L29/78,655@G,H01L29/78,657@C,H01L29/78,657@F,H01L29/78,658@F,H10D8/50@E,H10D8/50@L,H10D84/80,101@A,H10D84/80,203@C,H10D84/80,203@F,H01L29/78,658@G,H01L29/91@E

Stage: Grant (IP right document published.)

Filing Date: March 2, 2022

Publication Date: Sept. 14, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.