Japan Intellectual Property Rights: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Japan, Jan. 23 -- RENESAS ELECTRONICS CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF.' Other related details are as follows:

Application Number: JP,2022-067732

Category (FI): H01L29/78,301@S,H01L29/78,301@D,H01L29/78,652@B,H01L29/78,655@A,H01L29/06,301@V,H01L29/06,301@G,H10D12/00,101@B,H01L29/78,652@M,H10D30/66,101@D,H10D30/66,101@H,H01L29/78,658@G,H01L29/78,658@F,H01L29/78,652@Q,H01L29/78,655@G,H01L29/78,652@P,H01L29/78,652@N,H01L29/78,655@B,H01L29/78,652@D,H01L29/78,652@J,H01L29/78,653@C,H01L27/088@D,H01L27/088@B,H01L27/06,102@A,H01L27/06,321@B,H01L27/06,321@F,H01L29/78,301@V,H10D30/66,103@Q,H10D30/66,103@B,H10D30/66,103,H10D30/66,102@F,H10D30/66,102@D,H10D12/00,101@A,H10D30/66,103@C,H10D30/66,102@S,H10D84/83@D,H10D84/83@B,H10D84/80,101@A,H10D84/40@F,H10D84/40@B,H10D62/10,101@V,H10D62/10,101@G,H10D30/01,301@G,H10D30/01,301@F,H10D30/60@S,H10D30/60@V,H10D30/63,H10D30/65,H10D30/66,101@B,H10D12/00,101@D,H10D12/00,101@H,H10D12/00,101@P,H10D12/00,102@D,H10D12/00,102@F,H10D12/00,103,H10D12/00,103@B,H10D12/00,103@Q,H10D12/00,103@S,H10D12/00,201@C,H10D12/01@F,H10D12/01@G,H10D30/66,201@C

Stage: Grant (IP right document published.)

Filing Date: April 15, 2022

Publication Date: Oct. 26, 2023

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.