Japan Intellectual Property Rights: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Japan, Feb. 27 -- MIRISE TECHNOLOGIES CORP,DENSO CORP,MITSUBOSHI DIAMOND INDUSTRIAL CO LTD,TOYOTA MOTOR CORP has got intellectual property rights for 'SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF.' Other related details are as follows:

Application Number: JP,2022-121410

Category (FI): H10W72/30@A,H10P58/00@G,H10P58/00@V,H01L21/78@G,H01L21/52@A,H01L21/78@V

Stage: PROBLEM TO BE SOLVED: To provide a semiconductor device capable of suitably suppressing unnecessary wetting and spreading of solder when solder-joining a semiconductor substrate, and a manufacturing method thereof.SOLUTION: A semiconductor device 10 comprises a semiconductor substrate 12 and a metal layer 20 provided on a surface of the semiconductor substrate. The metal layer comprises a first metal layer (a nickel layer 24 and a titanium layer 22) and a second metal layer (a metal layer 26) covering a surface of the first metal layer and having higher solder wettability than the first metal layer. The second metal layer is exposed on a principal surface of the metal layer. The first metal layer is exposed on a side surface of the metal layer. A principal surface 20a of the metal layer is provided with a protrusion 30. The protrusion extends so as to make a circuit along an outer peripheral edge of the principal surface.SELECTED DRAWING: Figure 1 (Grant)

Filing Date: July 29, 2022

Publication Date: Feb. 8, 2024

The original document can be viewed at: https://www.j-platpat.inpit.go.jp/p0100

Disclaimer: Curated by HT Syndication.